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FREESCALE SEMICONDUCTOR
RF Division
Tempe, AZ
Semiconductors
Web Site

HFSS for circuit components

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Freescale is a leading global semiconductor company focused on providing embedded processing and connectivity products to large, high-growth markets. The company provides products to the automotive, networking, and wireless communications industries.

THE NEED
To develop a general procedure to examine the effects of plastic encapsulation on circuit components

THE SOLUTION
HFSS™

As part of its rigorous CAD-based design methodology, Freescale developed a comprehensive set of techniques for the measurements and simulation of packages, arrays of bonding wires, and packaged circuits.

The design team observed detectable changes in performance in all of the devices after encapsulation, including noticeable differences in the S-parameters, reduced package isolation, increased capacitance, increased loss, and frequency shift. "HFSS was able to accurately predict all of these plastic effects," said Peter Aaen, Freescale RF Division.

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RELATED MEDIA

Presentations
Source Date Title Author
2005 HFSS Users Workshop 02/16/05 A Methodology for the Accurate Simulation of Plastic Effects within Packaged Microwave Devices Peter Aaen, Freescale Semiconductor