Ansoft Customers - Kyocera America

Kyocera America designs, manufactures, and assembles a broad range of electronic packaging solutions for the telecommunications and semiconductor markets based on advanced ceramic and plastic material technologies. Its products and services support broadband, mobile and satellite communications, surveillance systems, sensors, automotive electronics, medical devices, computers, and consumer electronics.

THE NEED
To design a high-density, high-performance, OC-768 package fast and accurately

THE SOLUTION
HFSS�, Full-Wave Spice�

"HFSS is a powerful electromagnetic tool for modeling ceramic packages,� said Joseph Tallo, Kyocera America Inc. �It is absolutely necessary in the packaging world."

According to Tallo, Ansoft simulations enable:

The design of an interconnect over a required bandwidth
The characterization of transitions
The extraction of circuit models
Kyocera to provide its customers with the best technology for each application

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RELATED MEDIA

Presentations

Source Date Title Author

02/22/07 Interdigitated Capacitor Kyocera

Converge 10/27/05 Full-Wave Analysis and Characterization of Via Grounding Techniques Used to Decrease Electromagnetic Coupling Between Striplines Collaborating Companies: University of San Diego, Kyocera

2003 HFSS Users Workshop 01/25/03 Designing an X-Band T/R Module Package Joseph Tallo - Kyocera America

2002 Empowering Profitability Workshop 10/02/02 Modeling capacitance Multi-layer Ceramic Structures Kyocera - Heather Tallo

2002 HFSS Users Workshop 01/25/02 Designing an OC-768 Package Kyocera - Joseph A. Tallo

Articles

Source Date Title Author

2001 Electronic Components and Technology Conference 05/21/01 50 GHz Broadband SMT Package for Microwave Applications Kyocera Corporation, Japan