Presentations
The following presentations were given at Smart Engineering Simulation™ – Application Workshops for Electronic Design, held in various locations throughout North America, between October 6, 2009 and October 28, 2009.
The presentations are in Adobe Portable Document Format (PDF). To view them, you will need the free Adobe® Acrobat® Reader®. 
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- AMI Design Kit for IBM HSS15 Core Technology
- HFSS 12.0 Tips and Techniques for HFSS project setup and solve
- High Power IGBT Inverter Design
- Introducing HFSS Version 12
- Maxwell and HFSS Coupling to ANSYS 12.0
- RF Power Amplifier Design Using Coupled Circuit, EM, and Thermal
- Smart Engineering Simulation
- Spaceborne Array Design Using HFSS HPC Options
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- Coupled Electromagnetic and Thermal Solution for Electric Machine Design
- Electrical Circuit Battery Modeling in Simplorer
- PM Machine Demagnetization Analysis due to Fault Conditions
- Simulation Driven Product Development for Electromagnetic Applications
- Torque Optimization for Interior Permanent Magnet (IPM) Machines
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- ANSYS Multi-physics Solutions for LeadFree Electronics Manufacturing
- ANSYS Multiphysics Current Status and Future Directions
- ANSYS Solution to the Electronics Industry
- ANSYS solutions to Lead Free Package Design Challenges
- ANSYS solutions to Lead Free Process & Design Challenges
- Electronics cooling applications with ANSYS Icepak 12.0
