Presentations
The following presentations were given at the Empowering Profitability Workshop on September 16 - November 14, 2002.
The presentations are in Adobe Portable Document Format (PDF) . To view the presentations, you will need the free Adobe® Acrobat® Reader®. 
|
- Circuit Board Design for 10 Gigabit Small Form Factor Pluggable (XFP) Optical Modules
Bryan Boots, Eldon Staggs, Daniel Wu, Steve Rousselle - Modeling and Analysis of High-Density Interconnects for RFIC
Peter Shin, Aaron Edwards, and Denis Soldo - Full-Wave, High-Speed Packaging Design
Bill McGinn, Matt Commens, Markus Kopp - Frequency Selective Surface Design
Richard Remski, Brian Gray, Liza Ma - Rapid Elliptic Filter Design for Wireless Communications
Bernd Mayer and Martin Vogel - Design of LTCC RF Modules for communication systems
Ansoft Korea (Sean Kim, Charly Jeung, Robert Myoung, Jason Yun) - Advanced VCO Design Using Ansoft Designer®
Moriaki Ueno (Ansoft Japan) - Sub-Harmonic Mixer Design
Tony Donisi - Low-Noise Amplifier Design in MMIC Technology
Alain Michel - Power Integrity and Ground Bounce Simulation of High-Speed PCBs
Bull Ting, Lydia Cheng, Nilson Yu, Mike Brenneman
|
- The role of monolithic transmission lines in high-speed integrated circuits
Dr. Behzad Razavi, UCLA - Linking measurement with simulation
Stuart Gillen, Hall T. Martin, and Carl Petersen, National Instruments - Design of End-fire Antennas on Laminated Substrate
Michel Clénet, Gilbert A. Morin - Defence R&D Canada Jack Litzenberger, Yahia M. M. Antar - Royal Military College of Canada - Propagation delay in Serpentine Structures
Praveen Soora, Apple - Packages Packages (with Ansoft Tools)
ChipPAC - XFP: the Ultimate 10 Gb/s Solution
Dr. Lew Aronson, Finisar - Modeling capacitance Multi-layer Ceramic Structures
Heather Tallo, Kyocera - Analysis of High-speed Differential Line on PCB using HFSS™
Seungyong Baek, KAIST (Korea Advanced Institute of Science and Technology) - Design of 3D Integrated LTCC Antenna Switch Module Using HFSS
LGinnotek - Design, Measurement and Modeling of LTCC Embedded Inductors and PCB Balanced Devices
Prof. T.S. Horng, National Sun Yat-Sen Univ. - Planar Antennas for WLAN Applications
Kin-Lu Wong, National Sun Yat-Sen Univ. - Power Integrity Analysis in a split plane PCB
Feng Yu, Zhejiang University - Frequency Domain Characterization for Digital Applications
Dr. Eric Bogatin, GigaTest Labs
