Presentations
The following presentations were given at First-Pass System Success, held in various locations throughout North America, Europe, and Asia between September 11, 2006 and November 21, 2007.
The presentations are in Adobe Portable Document Format (PDF). To view them, you will need the free Adobe® Acrobat® Reader®. 
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- Achieving Design Closure throughout IC/Package/Board
- Circuit Simulation for First-Pass System Success
- Design and Modeling of High Speed High Density 3D CSP Packages and Memory Modules
Partner Company: Tessera Inc. - Design and Verification of an EPC Compliant Passive UHF RFID IC
Partner company: TSMC - Design optimization via co-simulation of Die, Substrate and Board
Partner Company: LG Electronics - IC2Package Design Flow at ST FMG R&D CAD
Partner Company: ST Microelectronics Srl - Ramping to Volume – Including Critical PCB & Packaging Effects in RFIC Design
Partner Company: UMC - WiMax MIMO Circuit and System Design
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- A Modular Platform for Accurate Multi-gigabit Serial Channel Validation
Partner Companies: Tektronix, Efficere - Accurate HFSS Simulation of SMT Components in SiP and MCM Designs
Parnter Company: Skyworks - Achieving Optimized Power Delivery using Adaptive Target Impedance
Partner Company: Wistron Corporation - Ansoft Designer with Nexxim - Statistical Eye Capabilities
- Chip Level Power Integrity
Partner Company: Hynix - Electromagnetic Field Dynamics inside Small Conducting Spheres
Partner Company: Intel - EM-Circuit Co-design for High-Speed Memory Applications
- Full Vehicle Electromagnetic EMI/EMC
- IC-Package-PCB Co-design_verification environment considering SI, PI, EMI
Partner Company: Kaist, TeraLab - Optimization of the High Performance Advanced packages for memory technology
Partner Company: Micron - PCB time domain simulation technique and and PCB EMS simulation technique
Partner Company: Samsung - Understanding and Preventing EMI
Partner Company: EMC - Utilizing LVDS to Reduce EMI/EMC in Network Cameras
Partner Company: Panasonic Electronic Devices Co., Ltd.
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- 1,5-40 GHz Meander Spiral Antenna Simulation and Design
Partner Company: Elettronica SpA - Antenna Performance Degradation Resulting From Aviation Fuel Exposure
Partner Company: Raytheon - Antenna Subassemblies for High Speed Wireless Datalinks
Partnering Company: Grante Corporation - Circuit-Electromagnetic Co-simulation of a Quadrifilar Helical GPS Antenna
- Complex Antenna System Design
- Design and Optimization of Surface Coil Array
Partner Company: GE Healthcare - Design of Antennas for Mobile and Vehicle Applications
Hanyang University - Design Optimization and Control of Conformal Microwave Array using Designer and HFSS: 3D Simulation for Treatment of Cancer
Duke University - Designing Electronic Systems and Vehicles to Survive Lightning and EMP Effects
- EMC Simulation Application Example
Partner Company: LG Electronics - Employing 65 nm CMOS for WPAN Applications
Partner Companies: CEA-Leti; ST Microelectronics - Fighting cancer with hyperthermia
Duke University - Left-Handed Metamaterials for Microwave Engineering Applications
UCLA - Simulation based RF SiP development for Satellite-DMB
Partner Company: Future Communications IC Inc.
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- Advanced Electro-Thermal Modeling of a Lithium-Ion Battery System for HEV Applications
University of Michigan-Dearborn - Analysis of Eddy Current Brakes used in Transportation and Industrial Automation
Partner Companies: Magtrol Inc, Valeo Telma - Ansoft Simplorer for functionally proven integrated circuit architectures
Partner Company: Exclara - Carbon-Carbon Ultracapacitor Equivalent Circuit Model, Parameter Extraction, and Application
Dr. John M. Miller, VP Adv. Transportation,
Dr. Uday Deshpande, Director Power Engineering
Dr. Marius Rosu, Group Leader Simplorer
Maxwell Technologies, Inc. San Diego - Colink Simulation for LIM Driven Electric Train System Using Simplorer and Recurdyn
Konkuk University - Compact high efficiency TFLM motor for reciprocating compressor applications
KERI - Design and Simulation of Power Converters using the Ansoft Power Suite
Dr. Roberto Prieto, Technical University of Madrid - Fuel Cell Stack Control and Interface Converter
KIER - High Voltage Automotive EMC Component Measurements Using and Artificial Network
Partner Companies: Daimler, General Motors - Integrating FEA into Existing Process Flows for Electrical Machine Design
Partner Company: Siemens AG - Low Delay, Digital PWM Controlled DC-DC Switching Power Supply
Partner Company: Nagasaki University - Motor conceptual development: Accelerating process from customer to production
Partner Company: Skurka - Optimization of Fast-Acting Actuators including Motion Induced Eddy Effects
Partner Company: MISO - Portable 5.85 - 5.925 GHz Vehicular Antennas using HFSS
Partner Company: Tyco Electronics - M/A-Com - Simulation and Design of Forces during Magnetically Assisted Fluidic Self-Assembly using Maxwell 3D
M.I.T. - Simulazione di un Sistema Ferroviario a Trazione Elettrica
Partner Companies: Italconsul Srl, Labor Srl - System Optimization of Motor Resolver including Drive Circuitry and Cable Parasitics
- The Power Ring Energy Storage Flywheel
Partner Company: LaunchPoint - Transformer, Inductor, Capacitor Innovation
- Using Simulation to Estimate Mosfet Junction Temperature in a Circuit Application
Partner Company: International Rectifier
