Presentations

The following presentations were given at First-Pass System Success, held in various locations throughout North America, Europe, and Asia between September 11, 2006 and November 21, 2007.

The presentations are in Adobe Portable Document Format (PDF). To view them, you will need the free Adobe® Acrobat® Reader®.   

• High-Performance IC and Advanced Packaging Design
• High-Performance Signal Integrity, Power Integrity and EMI
• High-Performance RF and Microwave Design
• High-Performance Electromechanical and Power Systems

• Achieving Design Closure throughout IC/Package/Board
  

• Circuit Simulation for First-Pass System Success
  

• Design and Modeling of High Speed High Density 3D CSP Packages and Memory Modules
  Partner Company: Tessera Inc.

• Design and Verification of an EPC Compliant Passive UHF RFID IC
  Partner company: TSMC

• Design optimization via co-simulation of Die, Substrate and Board
  Partner Company: LG Electronics

• IC2Package Design Flow at ST FMG R&D CAD
  Partner Company: ST Microelectronics Srl

• Ramping to Volume – Including Critical PCB & Packaging Effects in RFIC Design
  Partner Company: UMC

• WiMax MIMO Circuit and System Design
  

High-Performance Signal Integrity, Power Integrity and EMI

• A Modular Platform for Accurate Multi-gigabit Serial Channel Validation
  Partner Companies: Tektronix, Efficere

• Accurate HFSS Simulation of SMT Components in SiP and MCM Designs
  Parnter Company: Skyworks

• Achieving Optimized Power Delivery using Adaptive Target Impedance
  Partner Company: Wistron Corporation

• Ansoft Designer with Nexxim - Statistical Eye Capabilities
  

• Chip Level Power Integrity
  Partner Company: Hynix

• Electromagnetic Field Dynamics inside Small Conducting Spheres
  Partner Company: Intel

• EM-Circuit Co-design for High-Speed Memory Applications
  

• Full Vehicle Electromagnetic EMI/EMC
  

• IC-Package-PCB Co-design_verification environment considering SI, PI, EMI
  Partner Company: Kaist, TeraLab

• Optimization of the High Performance Advanced packages for memory technology
  Partner Company: Micron

• PCB time domain simulation technique and and PCB EMS simulation technique
  Partner Company: Samsung

• Understanding and Preventing EMI
  Partner Company: EMC

• Utilizing LVDS to Reduce EMI/EMC in Network Cameras
  Partner Company: Panasonic Electronic Devices Co., Ltd.

High-Performance RF and Microwave Design

• 1,5-40 GHz Meander Spiral Antenna Simulation and Design
  Partner Company: Elettronica SpA

• Antenna Performance Degradation Resulting From Aviation Fuel Exposure
  Partner Company: Raytheon

• Antenna Subassemblies for High Speed Wireless Datalinks
  Partnering Company: Grante Corporation

• Circuit-Electromagnetic Co-simulation of a Quadrifilar Helical GPS Antenna
  

• Complex Antenna System Design
  

• Design and Optimization of Surface Coil Array
  Partner Company: GE Healthcare

• Design of Antennas for Mobile and Vehicle Applications
  Hanyang University

• Design Optimization and Control of Conformal Microwave Array using Designer and HFSS: 3D Simulation for Treatment of Cancer
  Duke University

• Designing Electronic Systems and Vehicles to Survive Lightning and EMP Effects
  

• EMC Simulation Application Example
  Partner Company: LG Electronics

• Employing 65 nm CMOS for WPAN Applications
  Partner Companies: CEA-Leti; ST Microelectronics

• Fighting cancer with hyperthermia
  Duke University

• Left-Handed Metamaterials for Microwave Engineering Applications
  UCLA

• Simulation based RF SiP development for Satellite-DMB
  Partner Company: Future Communications IC Inc.

High-Performance Electromechanical and Power Systems

• Advanced Electro-Thermal Modeling of a Lithium-Ion Battery System for HEV Applications
  University of Michigan-Dearborn

• Analysis of Eddy Current Brakes used in Transportation and Industrial Automation
  Partner Companies: Magtrol Inc, Valeo Telma

• Ansoft Simplorer for functionally proven integrated circuit architectures
  Partner Company: Exclara

• Carbon-Carbon Ultracapacitor Equivalent Circuit Model, Parameter Extraction, and Application
  Dr. John M. Miller, VP Adv. Transportation,
  Dr. Uday Deshpande, Director Power Engineering
  Dr. Marius Rosu, Group Leader Simplorer
  Maxwell Technologies, Inc. San Diego
  

• Colink Simulation for LIM Driven Electric Train System Using Simplorer and Recurdyn
  Konkuk University

• Compact high efficiency TFLM motor for reciprocating compressor applications
  KERI

• Design and Simulation of Power Converters using the Ansoft Power Suite
  Dr. Roberto Prieto, Technical University of Madrid

• Fuel Cell Stack Control and Interface Converter
  KIER

• High Voltage Automotive EMC Component Measurements Using and Artificial Network
  Partner Companies: Daimler, General Motors

• Integrating FEA into Existing Process Flows for Electrical Machine Design
  Partner Company: Siemens AG

• Low Delay, Digital PWM Controlled DC-DC Switching Power Supply
  Partner Company: Nagasaki University

• Motor conceptual development: Accelerating process from customer to production
  Partner Company: Skurka

• Optimization of Fast-Acting Actuators including Motion Induced Eddy Effects
  Partner Company: MISO

• Portable 5.85 - 5.925 GHz Vehicular Antennas using HFSS
  Partner Company: Tyco Electronics - M/A-Com

• Simulation and Design of Forces during Magnetically Assisted Fluidic Self-Assembly using Maxwell 3D
  M.I.T.

• Simulazione di un Sistema Ferroviario a Trazione Elettrica
  Partner Companies: Italconsul Srl, Labor Srl

• System Optimization of Motor Resolver including Drive Circuitry and Cable Parasitics
  

• The Power Ring Energy Storage Flywheel
  Partner Company: LaunchPoint

• Transformer, Inductor, Capacitor Innovation
  

• Using Simulation to Estimate Mosfet Junction Temperature in a Circuit Application
  Partner Company: International Rectifier