PARTNER COMPANIES

A Modular Platform for Accurate Multi-gigabit Serial Channel Validation
Partner Companies: Tektronix, Efficere

Implementing multi-gigabit serial designs requires accurate and efficient methodologies to meet performance and time-to-market goals. New technologies standards like TMDS, PCIe gen2 and Hypertransport 3 require accurate models to account for the frequency dependant layout effects throughout the entire interconnect path. In addition, these technologies employ increasingly sophisticated pre-emphasis and equalization circuitry to optimize system performance and compensate for signal degradation in the channel. To meet these challenges, designers must adopt new, modular platforms that combine 3D EM modeling, measurement, and sophisticated circuit and simulation to produce valuable gains in procedural efficiency while maintaining the required high levels of accuracy.

The author will validate this new platform by comparing measurement and simulation for several multi-gigabit serial channels. The author will first decompose a 10 gigabit Tektronix reference design board into its constituent parts, run simulation, and highlight the most effective procedures to compare simulation and measurement in both time and frequency domains. A design kit with EM based parameterized models for Tektronix probes, sockets, and test fixtures will be shown along with the Tek’s unique Iconnect technology. Next, the author will add active circuitry for pre-emphasis, equalization, and transistor level models for the drivers and receivers to a Maxim designed multi-gigabit speed serial channel. Simulation and measurement will be performed to validate the platforms ability to predict for multi-gigabit designs that include non-linear active devices and frequency dependant effects from connectors, vias, transmission structures, and other critical PCB interconnects.
http://www.tek.com
http://www.efficere.com

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