INVITED SPEAKERS
Company	Speaker	Topic	Abstract/Bio
Freescale Semiconductor	Peter Aaen	A Methodology for the Accurate Simulation of Plastic Effects within Packaged Microwave Devices	Abstract/Bio
Hewlett-Packard Company	Karl Bois	On the Use of Tapered Lines for Electrical and Mechanical Reliability in High-end Servers	Abstract/Bio
Individual (formerly of Mahi Networks)	Romen Cubillo	Three Golden Rules for High-speed PCB SI Design	Abstract/Bio
Intel	Mohammad Kolbehdari	High-frequency Modeling of Next Package Generation	Abstract/Bio
Cushcraft Corporation	Peter Slettman	Analysis and Design of Radiating Elements Using HFSS	Abstract/Bio
Motorola	Sooliam Ooi	UHF Handset Monopole antenna designed for SAR compliance using HFSS	Abstract/Bio
University of CA, SF	Paolo Maccarini	Antenna Design Using HFSS for Hyperthermia Applications	Abstract/Bio
NAVAIR	Marvin Ryken	Conical Structures in HFSS	Abstract/Bio
Optimal Designs	Jim Reed	Combline Cavity Filter Design in HFSS	Abstract/Bio
Stanford Linear Accelerator Center (SLAC)	Valery Dolgashev	Design of Compact Multi-megawatt Mode Converter	Abstract/Bio

ANSOFT PRESENTATIONS
Company	Speaker	Topic	Abstract/Bio
Ansoft Corporation	Brad Brim	HFSS v10: Product Preview	Abstract/Bio
Ansoft Corporation	John Silvestro	HFSS v10 Jump Start for HFSS v9 Users	Abstract/Bio
Ansoft Corporation	Denis Soldo	High-speed PCB Design	Abstract/Bio
Ansoft Corporation	Aaron Edwards	High-speed IC Packaging Design (BGA)	Abstract/Bio
Ansoft Corporation	Bryan Boots	High-speed Via and Padstack Design	Abstract/Bio
Ansoft Corporation	Brad Brim	Combining HFSS with Circuit Analysis for Efficient RF/Microwave Design	Abstract/Bio
Ansoft Corporation	Brian Gray	Antennas and Scattering: What’s New or Different in HFSS v10	Abstract/Bio
Ansoft Corporation	Lisa Murphy, Jian Huang	Augmenting HFSS Design with Thermal Characterization	Abstract/Bio