Presentations
The following presentations were given at the High-Speed Design Forum on June 27-28, 2002.
The presentations are in Adobe Portable Document Format (PDF) . To view the presentations, you will need the free Adobe® Acrobat® Reader®. 
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- High-Performance Packaging Designs
Aaron Edwards, Ansoft Corporation - Ansoft SI for Today’s High-Speed Designs
Jonathan Smith, Ansoft Corporation - High Speed PCB Designs
Mike Brenneman, Ansoft Corporation
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- High-Frequency Simultaneous Switching Output Noise (SSO) Simulation Methodology For a DDR333/400 Data Interface
Woong Hwan Ryu, Hany Fahmy, and Henri Maramis, Intel Corporation - LLP: Maximizing Performance of Leadframe Packages
Neeraj Pendsé, National Semiconductor Corporation - Combining Multiple Simulations to 12.5 Gbps to Guide CAD Tool Use
- Simulations in Guiding Gpbs PCB Design of Communication Systems
Zhen Mu, Sycamore Networks Inc. - Realizing 5Gb/s on Standard FR4 Channels
Bill Beale, Accelerant Networks - High-Speed Channel Simulation Methodology
Ashraf Badawi, Intel Communications Group - Electrical Modeling for High Frequency IC Package Designs
Gordon Kelley, IBM Microelectronics
