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1. Phased Array Antenna System Design
(A two-part tutorial) Custom
radiation patterns can be produced from a phased array antenna to meet particular
system requirements. By properly assigning a specific amplitude and phase to
each array element, the antenna can be designed to produce a cosecant-squared
main beam that creates ground illumination with equal power versus distance. Such
antennas are useful for radar ground mapping and cellular base-station
applications. In this
presentation, Ansoft will discuss how advances in modern simulation address the
challenges when designing a modern phased array system. It begins with
discussion of the antenna array, feed network, and active power amplifiers that
drive the elements. It will be shown that co-simulation using Nexxim® harmonic
balance and HFSS™ electromagnetics can predict antenna radiation performance
that includes load pulling of and gain compression of the power amplifiers. Each
element in the array is excited at a different power level to produce the
shaped beam; therefore, some of the power amplifiers will experience gain
compression while others do not. The analysis results illustrate this behavior,
and pattern degradation versus input overdrive is demonstrated. 2. Antenna Platform-Level
Integration Partner
Company: HP Communications
antennas are generally designed assuming that the antenna exists in a free
space environment without interference from other antennas or the platform upon
which the antenna is mounted. In practice, antennas are often placed in close
proximity to one another (e.g., on a ship’s mast, on the fuselage of an aircraft,
or even within a laptop computer). This
presentation shows how powerful features in HFSS™ can be used to calculate
coupling between antennas to evaluate antenna coupling and radiation
performance. Attendees will learn how to use the HFSS DataLink feature to
cascade multiple HFSS antenna and scatterer projects and how to apply the HFSS
fields calculator to compute antenna coupling. A design and simulation flow for
co-site antenna analysis and antenna placement studies will be presented. The
presentation concludes with a detailed example of antenna placement on a personal
network printer platform. 3. RF Module Design Automation: Ansoft
Links ( Partner
Company: Skyworks Skyworks
Solutions is a leading supplier of high-performance analog and mixed-signal
semiconductors for mobile connectivity. Their RF modules are highly detailed,
compact, and integrated. The Skyworks design flow includes module package
design in Cadence APD followed by full module electromagnetic extraction using
HFSS™. In this
presentation, Dr. Weimin Sun of Skyworks will present a new version of AnsoftLinks™,
co-developed by Ansoft and Skyworks. The new tool provides a direct export
capability from APD to HFSS with all ports, boundaries, materials, frequency
sweeps, and other solution parameters set for immediate HFSS simulation. Examples
will be shown to demonstrate the speed and efficiency of the new Skyworks flow. 4. Radome Design for Airborne Radar
Using New Boundary Conditions in HFSS Modern
aircraft utilize electromagnetically transparent radome structures to protect
antennas from environmental stresses while preserving the aerodynamic integrity
of the vehicle’s superstructure. This presentation teaches the electromagnetic
fundamentals of radome design at high frequencies. It begins with a discussion
of the requirements and design trade-offs for radome bandwidth, frequency
selective behavior, field transmission, antenna beam degradation, and scan
performance. Advanced simulation techniques, including field-to-field data
linking and the use of conformal frequency selective surfaces (FSS) also will
be shown. Simplified transmission line equivalents are developed so that a
circuit analogy can be used for design. The
presentation then delves into the details of advanced 3D field simulation of
complex radome structures, including model creation, boundary condition setup,
and simulation parameters. A new boundary condition that will appear in an
upcoming version of HFSS™ is demonstrated and shown to have particular benefits
for radome design and simulation. The new boundary condition lifts the
limitation of shapes and thickness of the dielectric lamina while saving
calculation memory and time. The presentation concludes with a demonstration of
phased array antenna performance with and without the radome in place. 5. Recent Advances in Numerical
Simulation of Biomedical Applications Traditional
biomedical applications relied on prototypes and measurement for their
development. Today's simulation technologies allow older devices to be improved
and entirely new applications to be developed. At this time, there is
significant interest in applications where electromagnetic fields interact with
the bio material. Whether an SAR evaluation, a simulation of a specific
surgical procedure, or a prosthetic device, recent improvements in software
capabilities and cheaper computational power are enabling the expansion of
research in those areas where experiments are inherently difficult and/or very
costly to perform. This presentation begins by highlighting several traditional
biomedical device applications and a transition toward applications for which
the interaction between electromagnetic fields and the body play a central
role. Next,
sophisticated numerical models for hyperthermia treatment planning of cancerous
tumors are presented. The numerical models demonstrate a multi-physics-based approach
that captures complex electromagnetic, thermal, and fluid interactions. Thermal
features will be modeled in ePhysics™ and fluid interactions will be modeled
with appropriate convective boundary conditions. Low- and high-frequency
simulations will be presented using both HFSS™ and Maxwell®. 6. 60GHz Phased Array: Design and
Measurements Partner
Companies: Ogino/Taiyo Yuden The
worldwide 7GHz unlicensed band around 60GHz provides the possibility of
gigabit-per-second wireless communication and is a real opportunity for
developing next-generation wireless personal area networks (WPANs). There is,
however, a high path loss associated with the millimeter-wave band. That path
loss can be mitigated by directing the radiation using phased array antennas. This
presentation details the design and simulation of a 4 x 4 element phased array
antenna system at 60GHz. The antenna is produced on a low-cost PCB with beam
position and shape controlled digitally using UMS MMIC phase shifters contained
in the Ansoft UMS library. The presentation will detail the design concept,
circuit and planar electromagnetic simulation, and measurement results. The 4 x
4 element array is simulated using the planar Method of Moments simulator in
Ansoft Designer™. Those results are dynamically linked to circuit simulations
in Nexxim®. The pushed excitation feature is used to excite the EM simulation
so that far-field patterns can be computed while including all of the parasitic
effects. Nexxim transient simulations also are performed to examine system
behavior under transient switching input. Microwave
engineers have long relied on Maxwell’s equations to develop distributed models
for the high-frequency performance of waveguides, stripline and microstrip
transmission lines, coaxial lines, and other waveguiding structures. Today’s
microwave and RF design challenges go far beyond the addition of a few
electromagnetics-based models to a circuit. The trend in RF, microwave, and
high-performance electronics product design is toward accurate prediction of
comprehensive system-level behavior with electromagnetic simulation at the
core. This presentation highlights this trend by introducing several examples
that show how an engineer uses today’s simulation tools to visualize the
electromagnetic fields in his or her device, understand the device’s electrical
behavior to an unprecedented degree, and build virtual products that work as
predicted when manufactured. The first
example is an eight (8) pole elliptic filter that uses round cavities as the
resonating elements. This model employs modular filter building blocks that can
be used to create any order filter quickly and efficiently in Ansoft Designer®.
There will be a large number of tunable parameters in this filter design.
Optimization procedures using a dynamic link between Ansoft Designer and HFSS™,
Ansoft’s Optimetrics™, and the distributed solve option (DSO) will be shown. The second
example will be the optimization of a parabolic reflector dish at two different
frequencies (~2GHz). The optimization is to maximize the power being received
by two horn antennas at the feed location of a parabolic dish antenna for both
frequencies of interest. Design parameters include the feed location and the
dish’s parabolic curvature. This design optimization will demonstrate the new
capability of hierarchical order basis functions and explain how these are used
to improve both the efficiency of computer resources and time. The dynamic link
between HFSS and Ansoft Designer will be used to manage the optimization of the
design and to demonstrate the benefits of using the circuit analysis
capabilities to efficiently manage the optimization of a full-wave simulation. 8. Employing 65nm CMOS SOI for 60GHz
WPAN Applications, Pt. 2 Partner
Company: CEA-LETI The
worldwide 7GHz unlicensed band around 60GHz provides the possibility of
multi-gigabit-per-second wireless communication and is a real opportunity for
developing next-generation wireless personal area networks (WPANs). Additionally,
the availability of inexpensive complementary metal oxide semiconductor (CMOS)
silicon-on-insulator (SOI) technology in the nanometer technology node like
65nm offers an alternative to expensive III-V semiconductors, such as gallium
arsenide for millimeter-wave (MMW) applications. Developing circuits at MMW
frequencies using the 65nm CMOS SOI process is challenging and requires new
design methods and flows. The first
part of the presentation will overview WPAN applications and explain the
benefit of the 60GHz band. Next, challenges associated with millimeter-wave
design and rationale for the selection of 65nm CMOS SOI will be presented.
Several approaches to accurate, passive modeling in both time and frequency
domains will be highlighted. Specific
implementations of parametric models from 0 to 110GHz using 3D HFSS™ with a new
feature, dynamic link, will be shown and compared to analytical models. The
second part of the presentation will review each block of the receiver
including, LNA, mixer, VCO, and divider. Correlation between simulation and
measurements will be presented. Simulation results for combined blocks
(LNA+mixer and VCO+Buffer+Divider) and simulation results for the complete
receiver will be shown. 9. THz Waveguide Structures Modeling and Measurement Partner Organization: Portland State University Terahertz (THz) spectroscopy is a promising new technology that has the potential to detect explosive devices, provide safe high-resolution medical imaging, and extend the ability for non-destructive evaluation. Currently there is no efficient way to guide a broadband THz source, which is a critical need for many applications. In this presentation we show measurements, simulation results, and analytical solutions for cylindrical, hollow-core, dielectric waveguides supporting waves in the G-band (140-220 GHz). The same approach can be extended to design quality waveguides in the THz regime (0.3-3.0 THz) for evolving spectroscopy systems. 10. RFID Antenna and System Design Partner Company: Intermec Technologies Radio frequency identification (RFID) is an automatic wireless data collection technology based on modulated backscatter. It is different from traditional wireless communication between two active transceivers because RFID transceiver (reader) needs to transmit and receive simultaneously in order to communicate with a tag. A practical knowledge of various system components (readers, antennas, propagation channel, and tags) and associated tradeoffs is important for understanding and optimizing RFID system performance.
This presentation consists of two parts. In the first part, we present a tutorial overview of UHF RFID systems, which covers history, operating principles and applications, forward and reverse links, tags and ICs, readers and printers, and, finally, testing and measurement methods. This tutorial includes simple analytical models that can be used for practical analysis and design of various RFID systems. In the second part, we give three practical RFID antenna design examples using Ansoft tools (Ansoft Designer® and HFSST): metal mount tag, handheld reader antenna, and printer coupler. We also give an example of block-level RFID reader modeling and simulation using Ansoft Designer. 11. Multi-Layer u-Coaxial Components for mm-Wave and Phased Array Applications PolyStrata is a new additive surface micromachining technology enabling multiple layer passive components and multi-chip packaging. Ultra-low line and component losses, high antenna radiation efficiencies and good pattern, amplitude and phase controls have been obtained during the 3D-MERFS Darpa Program. The design, simulation, fabrication and measurements of various 3D structures are presented. Simulation of µ-coaxial lines (RCLs), directional couplers and Ka-band antenna showing extremely good correlation with measurements also are presented. The current Darpa work, which develops monolithic, high-density, multi-level, low-profile Ka-Band Phased Arrays on 6" PolyStrata wafer, will be presented. 12. Parasitic Arrays for Simplified Tunable Radiation Patterns This presentation details parasitic array antennas for beam steering using mutual coupling effects. This, for example, could be relevant for the auto industry in that it provides intelligent beam steering without the difficulty of a phased array system. Ansoft's HFSS™ is used to demonstrate the capabilities of using tunable reflectors to redirect energy to create steerable pattern. 13. Tunable Front End Filters for Adaptable and Cognitive Radio Architectures This presentation will discuss the development of tunable filter systems for cognitive radio systems. The ability to select the appropriate band of reception by isolating waveforms prior to the RF electronics allows for high dynamic range wireless systems that are not band limited. As more and more functions and systems are integrated into a single form factor, the need to dynamically change the reception band is pressing. Ansoft's HFSS™ is utilized to design the filters and show the capability of the tuning mechanisms. 14. Designing a Complete Radiating System: Antenna Performance as a Function of Packaging Partner University: University of Illinois at Urbana-Champaign The emergence of personal wireless communication devices has brought increased attention to the performance of the antennas that enable wireless links. As the sizes of these devices become smaller and smaller, the antenna packaging plays as much (and sometimes more) of a role as the antenna itself in how the system performs. In this talk, we will present examples from some of our recent projects on the effects of packaging on antenna performance. First, we will discuss and illustrate with HFSS™ simulations the effects of ground plane size on the performance of electrically small antennas, which are increasingly included in everything from portable devices to vehicles. In particular, we investigate the effect of ground plane size on an electrically small spherical antenna, called the TM10 antenna. This antenna requires a particular current distribution and relies on the ground plane to contribute the appropriate image currents. Results indicate that the antenna's bandwidth is greatly affected by changes in ground plane size. Second, we will illustrate with HFSS the effects of antenna placement on the performance of frequency reconfigurable antennas in portable devices. With the proliferation of wireless services that each operate in different frequency bands, these antennas help to reduce size, weight, and cost by allowing all of the services to share one antenna. However, if these antennas are not positioned in packages properly, their performance will suffer. 15. New Developments in Designing Helical Resonator-Based Band-Pass Filters Using HFSS Partner Company: Space Engineering SpA The use of filters having helical resonators in radio frequency applications represents a well-known technology. These devices can be used in the 10 MHz to 1.5 GHz region with typical Q's from 200 to 5000. Currently, such devices are being used as high Q bandpass filters, band rejection filters, reference cavities, tuning elements for oscillators, front end filters for receivers, and for many other applications where high Q is paramount and large size prohibitive. However, a disadvantage of using conventional helical resonators in the front end filter of a radio receiver is that in order to obtain satisfactory image frequency rejection, many conventional helical resonators are needed, involving significant costs. A further disadvantage of using conventional helical resonators is that the amount of coupling is controlled by the size and location of the openings in the partitions, which must be accurately machined, again involving significant costs. Hence, it is an object of this presentation to illustrate how to overcome the above mentioned disadvantages. To do so, various filter topologies, based on the use of helical resonators, are simulated by means of Ansoft's HFSS™, taking advantage of the fast-converging properties of Version 11. Indeed, inderdigitally allocated helical-resonators, indicating pseudo-elliptic transfer function have been compared to input-/output-port poles extrapolation configuration, leading into the final most effective (optimized) space qualified design of very complex BPFs structures, where the use of Rexolite 1422 is also involved for multipaction prevention reasons. Partner Company: Analogies SA This presentation will show the design of an Integrated Fully Differential Distributed Voltage-Controlled Oscillator in a 0.35 um SiGe BiCMOS process using Ansoft's solution for IC design. Electromagnetic and circuit co-simulation features in designs like this are the most important capabilities for the IC design flow to have. The seamless integration of Ansoft's HFSS™ and Nexxim® in Cadence's DFII flow aided to the development stage, making the design process fast, accurate, and easy. Ansoft HFSS has been used for accurate characterization of the differential transmission lines and passives used in this IC. Dynamic link co-simulation of HFSS designs within Cadence DFII flow is shown. Ansoft Nexxim played a beneficial role to the simulation of this VCO by providing fast and accurate simulation results using its advanced S-parameter handling and circuit co-simulation features. 17. Investigating Phase Center Variation due to Digital Beamforming The "Phase Center" is an essential quantity for characterizing antennas in precise navigation applications such as geodetics or avionics. Signal processing algorithms generally assume the radiated wave-front from the antenna is spherical at the target position. The position of the phase center defines the position of an ideal point source radiator for the purpose of system design. Therefore, accurate determination of the phase center is crucial for system design purposes. In practice, the phase center is an estimate of the true antenna phase front. It generally depends on the angular position of the target, the polarization and the range of solid angles of interest. Because this concept is critical for proper system design, it is essential that an unambiguous self-consistent technique be implemented to determine the phase center. The phase center of complex, highly directional antennas may be very difficult and costly to measure. Other factors such as antenna mounting, feed structure or measurement uncertainty can lead to additional errors. An efficient alternative to measurement is the application of mathematical methods that take advantage of 3D electromagnetic field simulation. These approaches save time and reduce uncertainty when compared with measurement, since the antenna environment may easily be varied and measurement uncertainty is eliminated.
The method used to determine the antenna PC position will be presented in this talk. This approach is currently used by the German Aerospace Center (DLR) to investigate phase center variations (PCV) caused by digital beamforming. The far-field data obtained from HFSS™ are used to analyze PCV for different incident signal directions of arrival under realistic antenna conditions, accounting for mutual coupling and output impedance mismatch. Several methods for phase center calculation will be presented and their advantages and disadvantages will be discussed.
Partner Company: FhG-IZM Polymer substrates offer a myriad of advantages for many electronic design applications (e.g., for high-frequency or high-temperature applications as well as for the development of embedded capacitors). Nonetheless, tailoring the physical properties to suit one application may lead to undesirable side effects in other areas. Additionally, substrate manufacturers may not supply accurate high-frequency electrical data. It is therefore important to characterize the electrical properties of the substrate materials for sensitive applications. For this characterization, efficient and accurate electromagnetic field simulation can be combined with RF measurements to provide reliable electrical data such as loss or dielectric constant. One of the main advantages of field simulation over analytical methods is that the effects of process tolerances (e.g., conductor etch angle, surface roughness, etc.) are easily accommodated. This presentation describes a step-by-step approach that is used to extract the electrical properties of polymer substrates and other packaging materials. 19. Integrated Antenna Design and Characterization for Communication Applications Partner Company: FhG-IZM The design and characterization of integrated antennas for communication applications (e.g., RFID, WLAN/WPAN, GSM/UMTS, etc.) require the combined approach of simulation, 3D electromagnetic analysis and measurement techniques. Since integrated antennas can generally not be tuned after manufacturing, accurate pre-layout design rules are required. This talk will describe some of the challenges encountered when designing antennas for communication systems. In particular, the need to employ design rules will be discussed in light of two examples: 1) the design of a bent antenna-coil for a 13.56 MHz RFID transponder integrated into a plastic ballpoint pen and 2) the design of efficient free-floating mm-wave antennas for communication and radar applications. 20. MRI RF Safety Investigation based on HFSS and ePhysics Co-simulation Partner Company: MPI Leipzig MRI safety guidelines define SAR and temperature rise limits for in-vivo experiments. Up to now, there is no reliable approach for measuring SAR and temperature profiles in-vivo. Hence, numerical investigations play an important role for the MRI safety certification process. Our implementation of SAR calculation is based on HFSS™ (magnetic field, power loss and permittivity) data exported to MATLAB®. Permittivity data and a look-up table can be used to model the mass density data required for SAR calculation. We have developed an in-house MATLAB procedure using multi-processor parallelization support, which can calculate SAR for an entire human model within a reasonable length of time (less than 30 minutes). HFSS magnetic field data were validated with phantoms using several MRI experiments, and partially with human subjects (since MRI-based surface models are not yet available for individual subjects). The close agreement between simulated and measured magnetic field profiles is only limited by uncertainty in the geometrical and electrical properties provided by manufacturers for MRI scanner hardware.
We have thus demonstrated that an HFSS-MATLAB bundle is a reliable and sufficiently fast tool for SAR investigation. A thermal property data set for human tissue was constructed using literature sources. Initial simulation results for a human model emphasized that thermal effects are extremely sensitive to the definition of boundary conditions, both external to the human model and between human model tissues. For better understanding of the static and transient thermal simulation results, a phantom-based test setup was designed. With MRI techniques, it is feasible to perform thermal measurements within a phantom with about 0.2 °C uncertainty at a rate faster than one measurement point per second (work in progress). Such measurements will allow reliable validation of simulated thermal data.
21. High Impedance Surfaces: Design and Modeling Partner Institution: Leibniz University Hanover This presentation describes the design and application of high impedance surfaces (HIS) for microwave applications. Simple design approaches based on the use of closed-form equations will be enhanced by implementing accurate three-dimensional full-wave analysis in Ansoft's HFSS™.
The first part of the talk reviews the difference between HIS and Electromagnetic Band Gap (EBG) structures in terms of their basic function and use. Subsequently, two design approaches for the realization of HIS structures will be presented. The HIS unit cell will be evaluated in HFSS using both the Floquet mode formulation and the special case of a normally incident plane wave on the infinite HIS. The periodicity of the infinite HIS is used in both cases to reduce the problem size to a single unit cell. Because the finite element matrix is symmetric when the incident wave is normal to the HIS surface, the simulation speed and memory requirements are significantly lower for this special case. These two methods will be compared, and an efficient design approach for the HIS unit cell will be proposed.
Simulation results will then be presented for a horizontal dipole antenna above a finite HIS ground plane. The analysis of the full antenna with a finite HIS is particularly valuable since the ideal properties of the infinite HIS are influenced by the finite size of the real HIS. The effect of the HIS on radiation pattern, efficiency and antenna input impedance will be reviewed and compared with ideal predictions. This investigation is summarized by presenting general guidelines for the applicability and validity of the basic HIS design equations. Rigorous three-dimensional analysis assists in the design of the unit cell and can be used to verify the effects of the finite HIS.
1. Virtual Compliance Test Bench
for PCIe, SATA, and HDMI High-speed
standard interfaces in electronics pose signal integrity challenges for
electronic product designers. Serial standards, such as PCIe, SATA, and HDMI,
are specified by standards bodies that provide specific metrics that must be
met in order for the product to comply with the standard. In this
presentation, Ansoft will demonstrate a new “Virtual Compliance” library for
PCIe, SATA, and HDMI standards. With this library, design engineers can quickly
and accurately create test benches using standards-based sources and sinks and
simulate compliance tests for their designed high-speed channels. The sources
produce bit patterns in accordance to the standard, and the sinks allow users
to terminate interfaces with the proper impedances. Rigorous transient,
frequency-domain, and statistical simulations are performed, and the resulting
data is used to produce eye diagrams, frequency-domain insertion and reflection
plots, and data tables for critical metrics that appear in the standard, such
as setup and hold time, random and deterministic jitter, eye height and width,
etc. Ansoft will teach how to use the new virtual compliance kits by examining
several specific channels. This
two-part tutorial teaches the fundamentals of coupled signal integrity (SI),
power integrity (PI), and electromagnetic interference (EMI). Traditionally,
the three disciplines are considered independently. SI design generally
considers point-to-point interconnections that may be affected by impedance
discontinuities, reflections, crosstalk, and signal distortion. PI design is
concerned with creating a reliable power distribution system across a
chip/package/PCB and/or system. EMI design is concerned with creating
electronic systems that do not radiate excessively and are not susceptible to
inbound electromagnetic radiation. Meeting
requirements for modern electronic design demands that SI, PI, and EMI are
considered together. Improperly designed interconnects may produce common
currents that radiate to produce an EMI problem; resonances on the power
distribution system may create radiation and/or can produce jitter, bit errors,
and simultaneous switching output noise (SSO); and, conducted and radiated
noise from in-system modules can diminish signal integrity. This
presentation discusses the fundamentals of SI, PI, and EMI and teaches how to
used Ansoft tools in the SI, PI, and EMI design flows. Details on 3D extraction
of connectors, PCB interconnect, cables and connectors using HFSS™, Q3D
Extractor®, and SIwave™ will be taught. The presentation concludes with actual
case studies where EMI is reduced by proper SI and PI design. Partner
Company: Seagate Modern
high-performance disk drives use high-speed serial interfaces such as SATA,
Fibre Channel, and SAS to provide the throughput needed for today’s data
storage applications. Proper system design is required to ensure that the fast
signals do not create excessive radiation from the disk drive system. Engineers
at Seagate have applied a novel electromagnetic plus circuit simulation flow to
evaluate serial channel signal integrity and system EMI performance. Modeling
of the driver was performed in Ansoft Designer®/Nexxim® with the 3D
electromagnetic models of a PCB, connector, interconnect, and a 3D housing
representing the disk drive. Circuit
simulation produced specific voltages and currents on the high-speed channel. Those
excitations were pushed back into the HFSS™ model to predict EMI radiation. It
was found that the greatest EMI radiation occurs at a frequency that correlates
with the resonant frequency of the disk drive housing. Seagate engineers also
demonstrate that the EMI spectrum had very strong dependence on the serial data
pattern and, hence, coupled circuit–electromagnetic simulation is essential to
predict the levels. The presentation provides a discussion of the modeling
strategy and correlations with lab measurements. Partner
Company: Altera It is
extremely challenging to diagnose the causes of signal integrity problems,
including timing failures, voltage state indeterminacy, cross talk, power rail
collapse, and electromagnetic interference after the system is prototyped.
Moreover, as advanced submicron nodes are pursued, multiple spins are becoming
increasingly expensive both in terms of mask costs and missed market windows. To
address these concerns, high-speed design and test engineers are turning to
robust simulation techniques and methodologies early in the design process. This
tutorial presents a design flow for a full, multi-Gigabit-per-second channel
that includes nonlinear drivers, BGA package, microstrip and stripline interconnects,
vias, and SMA connectors on a PCB. Each tool in the flow will be demonstrated
with an emphasis placed on developing an engineering intuition for each step in
the analysis. Correlation to measurement will be presented, and the new
features of the Ansoft signal integrity tool suite will be highlighted. 5. Statistical and Transient
Channel Modeling for Crosstalk, Bit Error, Jitter, and EMI This presentation
describes a SerialATA 3.0 Gb/s channel created using one-, two-, and
three-dimensional models. These various models have been combined with circuit
simulation techniques to provide channel bit error rates (BER) under different
de-emphasis settings. Analysis of the channel was performed using an aggressor-victim-aggressor
simulation strategy that included Gaussian random jitter (RJ) and deterministic
jitter in the form of duty cycle distortion (DCD). Finally, upon completion of
the statistical solutions, various bit patterns and edge rates are chosen to act
as the excitation source for near- and far-field plots on a backplane board.
This technique provides an innovative simulation strategy that combines full
channel analysis including radiated emissions dependent on drive strength and
bit patterns. Extreme
integration in modern RF products creates new signal integrity challenges for
electronic system design. Parasitic interactions in the chip, package, and
printed circuit board (PCB) can have a profound effect on radio performance. This
presentation provides details for analyzing silicon radio IC performance when
integrated with a QFN package and PCB. Low-cost radio chips use packaging
technologies that contain minimal power and ground layers. HFSS™ is used to
produce a full-wave model for the package, and SIwave™ is used to extract the
system host board. All parasitic and coupling effects are included in a
nonlinear circuit analysis to predict critical radio metrics such as DC offset,
intermodulation products, and noise figure. It is shown that it is possible to
predict system-level radio performance in a buildable, industrial-grade design. 7. 40 Gb/s Pre-emphasis, CDR, and
Equalizer CMOS Circuit Design with Full Channel Simulation The IEEE
802.3 Ethernet Higher Speed Study Group is charting the course to 40 Gb/s and
100 Gb/s serial rates. Migration to these high serial speeds is a very
promising way to provide high throughput while reducing the complexities and
costs of circuits, packages, and PCB. It does, however, create significant
challenges for circuit and system design engineers. This presentation discusses
the challenges and designs of a 40 Gb/s pre-emphasis driver, receiver (equalizer
& CDR), and full serial channel with a feasibility assessment based on the
65nm bulk CMOS technology node. New simulation technology in Ansoft’s Nexxim®
simulator is used to compute full channel response in terms of eye diagrams and
BER curves while including transistor-level designs for the driver and
receiver. 8. Tackling System EMI Problems Partner
Company: Panasonic Low voltage
differential signaling (LVDS) systems are used to achieve high quality, mass
data transmission in digital video and image equipment. Current development
trends are moving toward higher image resolution and voice quality. A critical
path to this goal is minimizing differential cross-talk, clock, and common mode
signaling, which often lead to system-level electromagnetic interference (EMI)
failure. EMI challenges, in particular, have been known to have a severe,
negative impact on time-to-market windows. This presentation outlines
Panasonic’s 9. Addressing Electromagnetic
Interference and Compatibility on Partner
Company: Samsung If not
properly designed, portable devices, such as cell phones and computers, can be
sources of, and susceptible to, undesired radiation. For example, cellular
phones and wireless LANs employing frequencies in the GSM bands (i.e., 800,
900, 1900MHz) are known sources of radiation noise. Often, this noise
originates in the device’s external ports, particularly when accessory cables
are connected to these ports. The spectral content of these sources generally
resembles that of synchrotron sources -- stronger at low frequencies and
diminishing at higher frequencies, though this noise is often modulated, or varied,
by the originating device in some way. The rich
harmonic content of these devices means that they can interfere over a very
broad spectrum. It is difficult to filter broadband RFI once it has entered the
receiver chain. At frequencies in the 10KHz to 30MHz range, noise readily
conducts along PCB cables and interconnects. At frequencies from 30MHz to 1GHz,
radiative transfer is dominant. In addition, the RF section in a cellular phone
can interfere with the baseband section; isolation is therefore required at the
device’s input. At this
point, we’ve come full circle. Radiation noise at terminal outputs link to
terminal inputs and are distributed to various internal circuitry. As a result
of this interconnected sequence of events, robust mobile wireless communication
designs require stringent signal-to-noise ratios for terminal products. This
presentation discusses ongoing experimental research involving characterization
and modeling of the noise performance of wireless, handheld devices, with
particular emphasis on terminal products. Partner
Company: MetaRAM This
presentation introduces a novel DDR3 memory module design that requires 30%
less power and has a 50% higher access speed rating compared to the standard DDR3-1066
specification. MetaRAM’s DDR3 MetaSDRAM is a new memory technology that doubles
or quadruples the amount of DDR3 SDRAM that can be integrated into existing
R-DIMMs without the need for system hardware changes. This memory expansion is
made possible by a technology that circumvents the normal limitations
established by the memory controller. The MetaSDRAM R-DIMM module pushes the
envelope on component density and frequency and was carefully simulated prior
to production. This presentation covers the simulation analysis and lab
measurement correlation on this complex MetaRAM R-DIMM design. 11. Numerical Modeling of ESD
Source and Protection Devices for Partner
Company: Samsung A simple
act such as walking across the carpeted floor and picking up your cell phone
can present a serious threat of electrostatic discharge (ESD) to the integrated
circuits within the mobile device. Internal leakage currents also present a
similar threat. Today’s high-performance circuit designers must include
measures to counter and suppress the potentially damaging effects of ESD. This
presentation introduces numerical models for both ESD sources and protection
devices. It begins by briefly discussing the causes and consequences of ESD
hazards at the package and board level. Numerical source models are introduced
and correlated to measurement. Using an advanced circuit simulation
environment, these models are integrated with models of ESD suppression devices
to simulate real-world conditions. Various design strategies intended to reduce
costs and increase reliability are tested. Board-level simulation results are
compared with measurement data. 12. High-Speed Serial Design Flow for Pre- and Post-Layout Verification Partner
Company: Altera It is extremely challenging to diagnose the causes of signal integrity problems, including timing failures, voltage state indeterminacy, cross talk, power rail collapse, and electromagnetic interference after the system is prototyped. Moreover, as advanced submicron nodes are pursued, multiple spins are becoming increasingly expensive both in terms of mask costs and missed market windows. To address these concerns, high-speed design and test engineers are turning to robust simulation techniques and methodologies early in the design process. This tutorial presents a design flow for a full, multi-gigabit-per-second channel that includes nonlinear drivers, BGA package, microstrip and stripline interconnects, vias, and SMA connectors on a PCB. Each tool in the flow will be demonstrated with an emphasis placed on developing an engineering intuition for each step in the analysis. Correlation to measurement will be presented, and the new features of the Ansoft signal integrity tool suite will be highlighted. 13. Analysis of Digital Display Frame Symbols and Their RFI Impact in Wireless Channels Partner Company: Intel Digital display frames and their associated symbols present a problem for the EMI engineer. Their spectrums fall somewhere between a purely repetitive symbol sequence, such as a clock, and a purely random sequence of a finite set of symbols, such as a pseudo-random bit stream (PRBS). Here we present a method whereby a selected set of display symbols can be ranked according to the expected EMI impact of their bit structure. The symbol set will be compared against the base clock from which the symbol is derived. The analysis will show that out of a given symbol set, a subset of the symbols should be used for highly repetitive sequences, such as blanking, to produce emissions that can be lower by up to 10 dB. This presentation will discuss single-ended symbols as seen at the input to a spectrum analyzer. Part II will cover the time derivative spectrums of single-ended symbols. Part III will then discuss differential signals and their radiated emissions. 14. Power Integrity Analysis Using SIwave on a UMTS Phone Partner Company: Motorola Modern mobile phone circuits require ever-increasing attention to power supply. The simultaneous reduction of voltage levels, the higher frequencies and the growing number of peripheral devices makes the design of PCBs more difficult with the traditional approach and require longer test cycles. The focus of this presentation is to describe a simple application of SIwave for the PCB analysis used in the FLIP side of a modern UMTS mobile phone. The existing PCB, developed with traditional methodology, is analyzed in term of performance for power integrity and the design is modified accordingly. The focus is on the layout routing and component placement. As a result, the modified FLIP shows how power supply noises can be minimized and how some components can be removed without affecting the performances. 15. Applying Rigorous 3D Field Analysis to Validate On-Chip RLC Extraction Partner Company: Advanced Micro Devices The market-driven improvement in performance of integrated circuits can largely be attributed to a reduction in the minimum on-chip feature size. These improvements result in higher switching speed, lower supply voltages and greater interconnect density. Consequently, the accuracy of full-chip extraction must be improved to account for effects that could previously be neglected without serious impact on the accuracy of the extracted circuit. In particular, the role of interconnect inductance must be considered. This improved accuracy, however, should not significantly impact the total extraction time for the chip which may already take several days.
This talk describes how rigorous three-dimensional field solvers (Ansoft's Q3D Extractor® and HFSS™) are used to verify the latest large-scale circuit extraction algorithms. The rigorous solvers enable an investigation of the trade-off between accuracy and simulation time. Recent developments in AnsoftLinks™ enable a smooth transition from the IC layout environment to the 3D solver interface. The integration of this verification method will be presented in the context of an existing design flow.
Partner
Company: Siemens AG In today's
competitive marketplace, motor designers continually face the challenge of
developing products that have better performance, lower costs, and smaller
footprints. Two phenomena that negatively impact motor performance are losses
and cogging torque. All motor losses lower the system’s overall efficiency and
create an additional source of heat that must be dissipated. In this
presentation, core loss, excess rotor copper loss, and permanent magnet eddy
loss will be examined. Cogging torque in permanent magnet synchronous motors is
the source of mechanical vibration, acoustic noise, drive system instability,
and is the primary cause of torque ripple -- all resulting in lower efficiency. This
presentation will show how finite element analysis is used to calculate core
loss, excess rotor copper loss, and permanent magnet eddy current loss. Two
machine types will be considered: three phase induction and permanent magnet
synchronous motors. Core loss characteristic curves are often measured at a
single characteristic frequency, but when the electric machine is fed by an
inverter, there are many harmonics that also need to be considered. Methods
demonstrating how core loss coefficients can be extracted from multiple core
loss curves will be presented. Simulated results will be compared to measured
values. This
presentation also will show how a multi-objective cost function can be used to
minimize the cogging torque of a permanent magnet synchronous machine. To
accomplish this, a genetic algorithm and finite element transient solver will
be used. This multi-object cost function includes minimizing cogging torque,
maintaining the average air gap flux density, and minimizing the volume of the
permanent magnet. The results will show how the cogging torque can be reduced
while maintaining the air gap flux density and reducing the magnet volume. 2. VHDL-AMS Modeling of an Electric
Power Steering System in a Multi-Physics Simulation Environment The
required torque for an electric power steering (EPS) motor is increasing,
especially for luxury sedans and large sports utility vehicles. In heavy
vehicles, being able to turn the steering column without moving forward and
steering during emergency conditions both present a heavy load to a conventional
12V battery system. As a result, battery power management and the battery’s
voltage behavior during heavy loading have become more important. To address
these emerging concerns, engineers are adopting multi-domain simulation
techniques and are relying less on traditional build-and-test methods. Through
the use of these new simulation techniques, product developers are shortening
development cycle time, reducing total cost, and are creating more reliable
designs. This
presentation will show how the VHDL-AMS language can be used to simulate the
multi-physics effects of an EPS system, including the electric machine, power
electronics, torque-assisted drive control, and the mechanical steering
mechanism. A step-by-step approach will be used to build the entire system from
primitive components. 3. Nissan Motors' S-Tool: A
Multi-Physics and Rapid-Prototyping Simulation Environment Partner
Company: Nissan Motors Higher
switching frequencies and smaller form factors are forcing automotive engineers
to consider package and board thermal and stress analysis more closely. This
presentation describes how 3D electromagnetics coupled with advanced circuit
simulation can be extended to include robust thermal and stress analysis. This
presentation is an introduction to Nissan Motors' vision of a simulation
environment that incorporates circuits, electromagnetic field analysis,
parasitic extraction, and thermal analysis within the context of comprehensive
and full-scale automotive models. To accomplish this, Nissan is developing its
Super-Tool, a multi-physics simulator whose objective is to reduce prototyping
costs and development time. This presentation will show how the S-tool
environment helps engineers develop their concepts from detailed component-level
designs to entire system integration. 4. Actuator Design: Meeting your
Customers' Requirements for Success Actuator
design engineers have to adhere to a specific set of customer requirements that
include size, weight, cost, force versus gap, closing times, and temperature.
Attempts to solve these multiple requirements in unison often lead to lengthy
design cycles spent building and testing multiple iterations whose end result
is an over-designed, non-optimal solution. This presentation introduces a
virtual prototyping design methodology intended to guide engineers to the
optimal solution in the shortest period of time. Using the methodology, several
actuator topologies will be investigated. Additional capabilities that will be
explored include a full force vs. stroke requirement and minimizing closing
time optimization method, statistical analyses for estimating manufacturing
tolerances, and a parametric (optimization) analysis that includes a full drive
circuit and related controls. 5. Simulating EMC/EMI Effects for
High-Power Inverter Systems Partner
Companies: High-power
IGBT-based inverter systems have specific electromagnetic compatibility (EMC)
and interference (EMI) requirements. While these requirements vary between
industries and countries, they are always present in some form. Because
component interactions have been difficult to predict, especially at the system
level, traditional EMI and EMC analyses have relied on multiple build-and-test
iterations. Today, advanced simulation tools and techniques are greatly
reducing EMI/EMC verification cycles. A method
for predicting a power module’s EMI/ EMC behavior, developed by Lab
Pearl/Alstom Transport, will be introduced. These power modules are used in
high-speed trains and include IGBT/diode packages. An accurate prediction of EMI/EMC
effects requires the combination of several simulation technologies, including
near- and far-field electromagnetic field computation, parasitic extraction of
the PCB nets and the IGBT package, accurate characterization of IGBT circuit
dynamics, and the capability to combine several different types of models in a
full system simulation. These techniques are part of an overall virtual
prototyping environment that is built on finite element analysis (FEA),
boundary element analysis (BEA), IGBT parameter characterization, and advanced
circuit simulation. The simulation results will be compared with measured
results. 6. Simulation-Based Performance
Characterization of an Electric Drive Train System Safe,
environmentally friendly, and highly efficient electric drive train technology
is being aggressively pursued in both the This
presentation introduces a simulation methodology that allows vehicle designers
to accurately predict vehicle system efficiencies so that optimal performance,
configurations, and control strategies may be identified. The methodology
presented herein emphasizes overall system performance while maintaining
accuracy at the component level. Component accuracy is realized through the use
of finite element electromagnetic field analysis. Several key components in
an electric drive system will be analyzed, including the traction motor,
field-weakening control, power electronics, and the energy storage unit. 7. New Simulation Capabilities are
Changing Power Electronics Design Partner Institution:
Automotive
and aircraft power delivery networks are getting smaller, lighter, and more
modularized. To realize these design goals and coordinate global engineering
activities, today’s engineers are relying more on sophisticated simulation
tools, such as Maxwell® and Simplorer®, and standards-based technologies, such
as VHDL-AMS. This presentation introduces two new capabilities that
significantly advance today’s production possibility frontier. A new
parameterization tool for the generation of commercial-grade DC/DC converters
based on data book information will be introduced. This capability provides
fast simulation times and no convergence problems for systems with several
conversion stages. The new user interface, VHDL-AMS model generation,
encryption capabilities, and correlation to measurement will be presented. The
presentation also will outline the application scope of the new technology and
demonstrate how multiple engineering disciplines can be integrated into the
Simplorer-Maxwell platform. A key
element of this integration is an enhanced dynamic link between the circuit
simulator, Simplorer, and the finite-element solver, Maxwell. This unique,
bi-directional link allows full-wave, 3D magnetic designs to be connected to a
time- and frequency-domain circuit simulation environment so that comprehensive
system-level effects and trade-offs may be investigated. Several real-world
examples will be presented. Power conversion systems are found in every type of electrical design—from laptop computers, to hybrid electric vehicles, to spacecraft. They are found in almost every product market, including military, aerospace, and industrial applications. Irrespective of the application, the methodology for DC/DC converter design is similar. This presentation will explore the design, modeling, and simulation process common to all DC/DC power conversion systems. The approach shown here emphasizes overall system performance while maintaining accuracy at the magnetic component level. Magnetic component accuracy is achieved by employing finite element electromagnetic field solvers to model the component’s physical geometry, material properties, and nonlinear effects. The design of individual components, including the power stage, control loops, PWM control, and integrated magnetic components, will be explored. After combining these components into a full system, methods and technologies for system-level simulation will be presented. 9. Analysis of Power Structure Bus Designs for AC Drives Partner Company: Rockwell Automation Complex bus structures are used in AC Drives to route power from the DC link capacitors to the IGBT power modules and the output terminals. In high-power drives, bus structures are a source of significant parasitic inductance. Design of the bus structure must minimize parasitic inductance to avoid transient over-voltages on the power devices that can occur because of PWM switching. Low inductance bus design will also reduce the need for snubber circuits. High-power IGBT power modules essentially consist of a number of low-current IGBT chips that are paralleled and packaged into a single large unit, with terminals to connect to the DC link and the AC output. The layout and interconnection of the individual chips within a large power module is critical to ensure that (a) parallel chips share current equally, (b) peak voltage across the chips does not exceed the breakdown level during a regular switching event or a transient event such as an output short-circuit, and (c) gate-emitter signal voltage is distributed to all chips without significant voltage drop or noise induced by the power currents. In many high-power IGBT power modules, the peak voltage across a chip cannot be measured directly. Even though some manufacturers provide Kelvin terminals for voltage measurement, in a multi-chip module, these measurements do not accurately represent the voltage across all the chips. Ansoft's Q3D Extractor® is an invaluable tool to model bus structures in an AC drive and the bus layouts of multi-chip IGBT power modules to determine the parasitic inductance, resistance, and capacitance parameters. A circuit simulation model of the bus structure can then be developed for use in Ansoft's Simplorer® to simulate the entire AC drive system and determine the peak voltages of interest. In this presentation, the use of Q3D Extractor for the analysis of AC Drive bus structures will be demonstrated with the following examples:
1. Optimum design of bus structure between the DC link and the IGBT power module of an AC drive, and placement of DC link capacitors in the bus structure to minimize the overall parasitic inductance seen by the IGBT power module
2. Analysis of the internal parasitic inductances of a high-power multi-chip IGBT power module to estimate the peak collector-emitter voltage seen by the various IGBT chips during a transient switching event
3. Analysis of a bus structure used to parallel the outputs of an AC drive using Q3D Extractor and Simplorer to study the effect of bus structure asymmetry on current sharing
Detailed simulation results will be presented with some experimental test data to validate the modeling and analysis. 10. An Introduction to Sensor Output Prediction and Optimization Using Ansoft Maxwell and MATLAB Partner Company: Cherry Electrical Products Sensor engineers rely on simulation early in the design process to evaluate and refine concepts. This presentation describes the systems that Cherry Electrical Products has implemented with the integration of Ansoft's Maxwell® and MATLAB® to accomplish these tasks and more. We will discuss sensor design and evaluation using Maxwell's built-in parametric modeling capabilities in conjunction with the advanced algorithmic and data presentation capabilities of MATLAB. We will cover: setting up parametric geartooth sensor (GTS) simulations, reducing the amount of storage necessary for the resulting data, and using MATLAB to handle the results. Specifically, we will discuss the advantages of using MATLAB scripts to accomplish all of these tasks plus data analysis, presentation, and simulation control. Some of the advantages to be discussed include an examination of the programming environment, the implications of revision control tools on such a programmatic approach to simulation, and the ability to model any number of sensor ICs within the simulation. Examples of correlation with real-world tests will be included throughout the presentation. 11. Ultracapacitor Heavy Transportation Module: Design, Model, and Performance Partner Company: Maxwell Technologies Ultracapacitors are finding wide acceptance in the energy storage industry for their high pulse power, extreme cycling capability, robustness, efficiency and calendar life. Heavy transportation in particular, with its demand for high-power shuttling of energy, benefits from the ultracapacitor energy storage module in meeting stringent requirements for 12-year operating life. In applications such as shuttle bus, city and transit bus, and truck application, the duty profile can range from 300 to over 1000 stops per day. In metro and subway train application, the heavy transportation modules rated 125V; 150Arms continuous are routinely stacked to form high-voltage strings of 500V to 750V in buses and from 1,150V in the past to recent requirements for 1,560V in trains. Equivalent circuit models for such packs must account for cell parameters, parasitic elements of interconnect ESR and ESL, and stringent isolation voltage requirements. This presentation covers the pack design, the electronic equivalent circuit model developed for Simplorer® simulation and parameter extraction using Ansoft's Q3D Extractor® of interconnect and cell parasitics. The ultracapacitor model developed will be available from Ansoft as a Simplorer v8.0 library model. 12. Simulation and Analysis of Resolver Sub-System for HEV Electric Drive Partner Company: Hitachi Resolver is widely used in electric drive systems especially for hybrid electric vehicles (HEV). A resolver sensor includes not only a variable-reluctance motor but an excitation circuit, shielding cables and a Resolver-to-Digital (R/D) IC as a multi-physics system with electrical, magnetic, mechanical, and control characteristics. This presentation studies a resolver for HEV electric motor, and proposes an integrated systematic approach using co-simulation between several commercial simulation tools to simulate the resolvers electromagnetism using finite element analysis method and transient solver, the excitation and termination circuits and the behavior model of Type II tracking closed loop algorithm used by the R/D IC. This systematic approach paves the way for a high-accuracy, system-level simulation, fault analysis and troubleshooting, etc., which can be used to develop component design, DFMEAs and system integration that match performance in the field and not just a simplified model. A bench test of the presented resolver system is completed to make correlation to validate the model, and the analysis of some fault conditions is provided to make concept proof of this method. 13. Vehicle Structural Components as Conductive Paths: A New Understanding Partner Company: General Motors Automotive vehicle structural components have been used since the origins of the automotive industry as a way to provide return paths for electrical current. This approach had several advantages, including minimal cost, mass, and simplified electrical circuitry construction without additional wiring. Over time, this became a standard method and even was described as "negative" or "positive" ground, indicating where the structure was connected to the "+" or the "-" terminal of the battery. While this approach worked well for decades, the demands of today's highly complex systems are identifying potential limitations of this approach and need to be well understood. Modeling of these structures is a key aspect needed for this understanding and the challenges and opportunities of this modeling will be discussed. 14. Investigating a Synchronous Electrical Machine Transient Behaviour Using a FEM Model Partner Company: Ansaldo Sistemi Industriali SpA In order to extensively investigate the transient behaviour of a three-phase synchronous machine, it is important to determine the value of the main electrical parameters involved in this kind of phenomena. In particular, considering a three-phase synchronous generator, the main transient phenomena that would interest the designer are three-phase and two-phase short circuits, which are affected by the values of the direct and quadrature sub-transient reactances. The damper cage and relative short-circuit ring of the machine rotor strongly influence these parameters. Taking into account the effects of the damper cage in a FEM calculation would require having a 3D model with a very accurate mesh. This would result in an unacceptably long solution time. For this reason, it is necessary to have a 2D FEM model coupled with an electrical circuit in order to simulate the presence and the peculiar configuration of the damper cage without significantly increasing solution time. Such a model calls for an accurate calibrating procedure based on experimental data collected during measurements of machine performance, as sub-transient inductance and stator impedance. The calibrated model is useful to verify machine behaviour during short-circuit and to calculate current spectrum and additional losses due to inverter feeding. This presentation describes how the calibrating process was performed and shows the results of two-phase short-circuit simulation compared to an analytical study. 15. SMPS Design with PExprt and Simplorer Partner Institution: University of Madrid Automotive and aircraft power delivery networks are getting smaller, lighter, and more modularized. To realize these design goals and coordinate global engineering activities, today's engineers are relying more on sophisticated simulation tools, such as Maxwell®, Pexprt™, and Simplorer®, and standards-based technologies, such as VHDL-AMS. This presentation introduces two new capabilities that significantly advance today's production possibility frontier.
A new parameterization tool for the generation of commercial-grade DC/DC converters based on data book information will be introduced. This capability provides fast simulation times and no convergence problems for systems with several conversion stages. The new user interface, VHDL-AMS model generation, encryption capabilities, and correlation to measurement will be presented. The presentation also will outline the application scope of the new technology and demonstrate how multiple engineering disciplines can be integrated into the Simplorer-Maxwell platform.
A key element of this integration is an enhanced dynamic link between the circuit simulator, Simplorer, and the finite-element solver, Maxwell. This unique, bi-directional link allows full-wave, 3D magnetic designs to be connected to a time- and frequency-domain circuit simulation environment so that comprehensive system-level effects and trade-offs may be investigated. Several real-world examples will be presented.
16. LRC-Extraction for Power Electronics Applications Partner Company: GE Global Research During the design phase of a power electronics system, the correct evaluation of the overall, stray and commutation inductances is very important to predict the performance of the system and to analyze if the possibility of exciting dangerous resonances exists. In this presentation, the application of the boundary element method is shown in order to correctly foresee stray and commutation inductances for a leg of an IGBT-based inverter. Different layouts will be compared, and experimental data and a comparison with FEA will be provided. The calculated frequency-dependent parameters will be exported to a circuit simulator so as to analyze the overall circuit behavior. 17. 3D Linear Actuator Simulation: Challenges and Results Partner Company: Oerlikon Die Firma Oerlikon ESEC entwickelt Maschinen für die Halbleiterindustrie, in welchen hochdynamische Achsen für die wachsenden Herausforderungen an die Prozess-Geschwindigkeit unerlässlich sind. Die 5 hochdynamischen Achsen im Bondhead des Wire Bonders - dem Herzstück der Maschine - sind alle als lineare Direktantriebe ausgebildet. Die Anforderungen an diese Antriebe bezüglich Maximalkraft liegen zwischen 1000N für den Hauptantrieb und 1.5N für den kleinsten Motor. Dazu sind Spezifikationen bezüglich Strom-Anstiegszeiten, Masse, Kühlung sowie Eigenresonanzen der bewegten Körper zu erfüllen, weshalb diese Motoren intern entwickelt werden. In diesem Vortrag werden die Herausforderungen der Auslegung der Linear-Antriebe beleuchtet. Die magnetostatischen Simulationen wurden alle mithilfe von Macro-Files gesteuert, um neben der Feld-Simulation auch mechanische und elektrische Berechnungen zu ermöglichen. Die Resultate dieser Entwicklungen werden anhand von Vergleichen zwischen Simulation und Messung aufgezeigt. 18. The Intelligent Integration of Traction, Bogie and Braking Technology Partner Company: Siemens The innovative Syntegra® power bogie technology breaks with today's technology in three main areas. Bogie, traction and braking technology are merged into a completely integrated system. In addition to this integration, several technological advances could be made. The new generation of powered bogies leads to high efficiency, reduced mass and decreased life cycle cost. The presentation will show a completely new gearless drive system for future metros and commuter trains.
Syntegra replaces the conventional complex drive system with gear by a very simple gearless direct traction drive system based on a high-torque permanent magnet (PM) motor. The electro magnetical design was developed with Maxwell® 2D.
The basic concept of the drive system was developed for a high-speed train application and is now adapted for a totally integrated drive for metro and commuter trains. The stator housing is made of cast iron with a rectangular cross-section being water cooled. The wheel set carries a rotor hollow shaft that is shrinked stiffly on the two ends. The rotor hollow shaft itself carries the magnets.
Due to the coaxial traction motor construction, the space requirement of the traction drive is minimized. The driving wheel set has only two bearings combining the regular wheel set bearings and the motor bearings. As a result, the high integration level leads to a very compact and lightweight power bogie.
A prototype metro train was equipped with two Syntegra bogies. After intensive testing at the Siemens test center in Wildenrath/Germany, the test train entered passenger service on Munich's underground metro system in August 2008.
1. ANSYS Vision and Strategy (40-minute keynote, morning
session) This
presentation will introduce ANSYS, Inc. and explain the company's Simulation
Driven Product Development vision and product strategy. It will emphasize
Ansoft’s instrumental role in realizing this vision. Our five-technology
advantage foundations will be introduced: Depth, Breadth, Multiphysics,
Engineered Scalability, and Adaptive Architecture. Each foundation will be elaborated
on and shown how it applies to various technology solutions, such as the ANSYS
Workbench simulation environment. 2. Thermal Management and CFD
Simulation (40-minute
breakout session) Ever-increasing
circuit and energy densities (smaller footprints, faster clock speeds) coupled
with energy-efficiency requirements create unique challenges for engineers
concerned with thermal management. Sophisticated multi-physics simulation solutions
with the ability to couple thermal, fluid dynamics and other physics are
required. This presentation will focus on the thermal and multi-physics
simulation capabilities of ANSYS Icepak, ANSYS Multiphysics and FLUENT.
Examples will illustrate chip, board, and system-level thermal analysis;
natural and forced-convection air cooling with radiation heat transfer; effects
of trace heating in package and PCBs; and fan design. More advanced topics
covered are micro channels, heat pipes, piezoelectric fans and thermoelectric
(Peltier effect) cooling. 3. Mechanical Reliability (40-minute breakout session) ANSYS,
Inc. provides a broad range and depth of mechanical reliability simulation
capabilities to our electronics industry users. Since thermal stress is the
number-one cause of electronic component failure, the most common simulation
performed is thermal stress analysis -- either steady state or time transient.
Mechanical vibration and moisture ingress are the second and third most common
failure modes. This presentation will focus on the capabilities of the ANSYS
Mechanical and ANSYS AUTODYN products relating to these top three failure
modes. Examples will illustrate: how a package thermal-mechanical analysis can
include advanced material properties to accurately capture creep and fatigue of
solder joints, the simulation of humidity and delamination effects in package
mechanical design, system and board-level mechanical loading, vibration and
modal analysis, and a drop test simulation. 4. ANSYS Product Demonstrations (Two back-to-back 40-minute
breakout sessions) These
sessions will provide live demonstrations of several of the ANSYS, Inc.
products discussed in the Thermal Management and Mechanical Reliability
presentations. Additionally, a more general demonstration of the ANSYS
Workbench platform and some of the key Workbench applications, such as the
Project Page, Design Modeler, Simulation, and DesignXplorer will be provided.
Each demonstration will walk through geometry creation (or import), meshing,
loads and boundary conditions, and solution and results post-processing. The
following will be demonstrated: Thermal Management (ANSYS Icepak: Airflow
cooling of a system-level model), Mechanical Reliability (ANSYS Mechanical:
Thermal stress and fatigue analysis of BGA), Mechanical Reliability (ANSYS
AUTODYN: Drop test of a cell phone), and Platform and UGI (ANSYS Workbench:
General demonstration of the Workbench environment, including Project Page,
Design Modeler, Simulation, and DesignXplorer).
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