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Presentations and Abstracts

•High-Performance IC and Advanced Packaging Design
 
•Delivering Solutions for 90nm for RFCMOS, Analog and High-Speed Circuit Design
•Recent Advancements in Circuit Simulation Technology
•RFID Radio Circuit Design in CMOS
•High-Performance Signal Integrity, Power Integrity and EMI
 
•Utilizing iPASS for 6Gb/s SAS and SATA Interconnect Design
•Signal Integrity Solutions for HDMI
•Designing Open MRI Systems including Human Body Models
•High-Performance RF and Microwave Design
 
•Pattern Synthesis, Aperture Design, and Radome Interaction for Complex Antenna Systems
•Enabling 60Ghz MMIC Design
•Optimizing the Design of 77Ghz LNAs
•New Microwave Library Accelerates Waveguide Design
•Advanced Packaging and PCB Design
 
•Power Integrity: IC, Package, Board Co-Design
•System In Package (SIP) and Stacked Package Solutions
•Suppressing Power and Ground Noise in High-Performance Consumer Electronics
•High-Performance Electromechanical and Power Systems
 
•Ultra-High-Speed Motor and Engine Cranking System
•Design of Interior Permanent Magnet Machines for Hybrid Electric Vehicles
•Modeling Frequency-Dependant Effects in Time Domain
•Advanced Techniques for Greater Accuracy, Capacity, and Speed
•Ventilation System Motor Drive Design and Analysis
•Large Scale Simulation of Eddy Current Probes for Non Destructive Testing
•EMI Modeling and Characterization of a Flyback SMPS