Ansoft High-Performance Design News & Events

SiP Design
Michael Brenneman, Technical Director for Packaging & PCB at Ansoft, was invited to share his thoughts on SiP simulation during a panel discussion at this year’s FSA System-in-Package Conference in San Jose. Michael discussed industry trends, SiP co-design challenges, and working within existing design flows. According to Michael, “A unified SiP design flow does not assume a single-vendor flow. Best-in-class design flows incorporate best-in-class solutions for extraction, simulation, and design management that leverage 3D EM accuracy at the circuit and system level in both the time and frequency domains.”
View Presentation (PDF, 1.9 MB)

MARCH 2007 • VOL. 3, NO. 1

TEXT-ONLY VERSION

1. SAMSUNG Releases MLCC Library for Nexxim and Ansoft Designer
2. TPA v5 Targets Advanced SiP, CSP, and Stacked Packaging
3. RF Packaging Trends Webcast Available On Demand
4. Online Technical Library Launched
5. Ansoft Third Quarter Earnings Increase 48%
6. Ansoft Executives Receive Emerald E-3 Award

EVENT*	DATE	LOCATION
TRAINING
HFSS	March 13	Irvine, CA
HFSS	March 14	San Jose, CA
Simplorer	March 28-29	San Jose, CA
HFSS	April 3	San Jose, CA
Ansoft Designer	April 4	San Jose, CA
HFSS	April 5-6	Boston, MA
HFSS	April 11	Irvine, CA
Ansoft Designer	April 12	Irvine, CA
TRADE SHOWS
PCB West	March 27-28	San Jose, CA, Booth 1202
SAE World Congress	April 16-19	Detroit, MI, Booth 1921
IEEE Radar	April 17-20	Waltham, MA, Booth 1
*For the latest information on dates, times, venues, agendas, and registration, click on the links above.

PRODUCT*	VERSION	WINDOWS	LINUX	SOLARIS
Ansoft Designer	3.5	•	•	•
AnsoftLinks	4.0.2	•	•	•
DesignerSI	3.5	•	•	•
ePhysics	2.0	•	•	•
HFSS	10.1.3	•	•	•
Maxwell 2D	11.1.1	•	•	•
Maxwell 3D	11.1.1	•	•	•
Nexxim	3.5	•	•	•
ParICs	3.1	•	—	•
PExprt	6.0.34.0	•	—	—
Q3D Extractor	7.1.1	•	•	•
RMxprt	11.1.1	•	•	•
Simplorer	7.0.5	•	—	—
SIwave	3.1.1	•	•	—
TPA	5.0	•	—	—
To download the latest software versions, please visit http://download.ansoft.com. To search our knowledge base, browse support content, download training materials, or participate in our online technical forums, go to http://www.ansoft.com/ots*.

1. SAMSUNG Releases MLCC Library for Nexxim and Ansoft Designer (top)

SAMSUNG has released a new model library of its high-density, miniaturized surface-mount Multilayer Ceramic Chip Capacitors (MLCC). The new MLCC library allows engineers using Nexxim® and Ansoft Designer® to simulate advanced PCB and hybrid IC designs.
Read More »

2. TPA v5 Targets Advanced SiP, CSP, and Stacked Packaging (top)
Turbo Package Analyzer™ (TPA) v5 introduces new automation, design flow, and simulation capability needed for the extraction of the electrical characteristics of complex high-performance ball-grid array (BGA) style packaging, including wirebond (WBBGA), flip-chip (FCBGA), chip-scale packages (CSPs), and system-in-packages (SiP). TPA v5 increases the capacity of the solver to address larger-sized packaging problems and introduces greater automation for generating and/or modifying 3D package layouts.
Read More »

3. RF Packaging Trends Webcast Available On Demand (top)
The challenge to create new, increasingly complex, systems-in-a-package (SiP) at lower cost and in shorter lead times is pressuring industry companies to develop new methodologies to meet market demands. Miniaturization has been the hot trend over the past decade, and RF components are the critical parts for wireless communications and SiP. View this IEEE Spectrum Online archived webcast to listen to industry experts from NXP and STATSChipPAC discuss the challenges and trends in SiP and RF stacked die packaging.
View Webcast »

4. Online Technical Library Launched (top)
Ansoft articles, white papers, and presentations are now available on the new Ansoft Technical Library site. Users can browse the reference database or search by keyword, application, product, or event.
View Technical Library »

5. Ansoft Third Quarter Earnings Increase 48% (top)
Ansoft announced financial results for its third quarter of fiscal 2007 ended January 31, 2007. Revenue for the third quarter totaled $22.7 million, an increase of 16% compared to $19.7 million reported in the previous fiscal year’s third quarter.
Read More »

6. Ansoft Executives Receive Emerald E-3 Award (top)
Ansoft executives Dr. Zoltan Cendes, founder and CTO, and Nicholas Csendes, CEO, received the Emerald Asset Management E-3 award for entrepreneurial excellence in the Science and Technology Company Executive category at the 14th annual Emerald Groundhog Day Investment Forum in Philadelphia.
Read More »

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