Q3D Extractor® is the premier 3D parasitic extraction software tool for engineers designing multi-layer boards, complex IC packages and 3D on-chip passive components. Q3D Extractor efficiently performs the 3D and 2D electromagnetic-field simulation required for the extraction of RLCG parameters from an interconnect structure and automatically generates an equivalent SPICE sub-circuit model. These highly accurate models can then be used to perform signal integrity analysis to study EM phenomena, such as crosstalk, ground bounce, interconnect delays, and ringing, and to understand the performance of high-speed electronic designs.

New in Q3D Extractor v8

• New Capacitance solver in Q3D Extractor that solves for C and G due to lossy dielectrics
• Infinite ground plane capability
• Multiprocessing and Distributed Analysis options
• Revised interface for 2D Extractor:
  • Improved 2D modeling
  • Simplified problem setup
  • Ability to perform discrete and interpolating frequency sweeps
  • Integrated Optimetrics™
  • Enhanced post-processing
  • New optional convergence criteria using power loss
  • Finite Conductivity Boundary added for surface roughness modeling
  • Advanced product coupling capability with Ansoft Designer® and Simplorer®
• Frequency-dependent dielectric loss model (Djordjevic-Sarkar)
• GDSII export