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3D/2D Parasitic Extraction for High-Performance Electronic Design
Featured Capabilities
- Quasistatic 3D electromagnetic-field analysis using Method of Moments (MOM) accelerated by Fast Multipole Method (FMM)
- Includes proximity and skin effect, dielectric and ohmic loss, and frequency dependence
- Pushbutton 3D extraction of resistance (R), inductance (L), capacitance (C) and conductance (G) matrices
- Infinite ground planes can be modeled
- Quasistatic 2D electromagnetic-field analysis using the Finite Element Method (FEM)
- Per-unit-length RLGC parameters for transmission lines
- Characteristic impedance (Z0) matrices
- Propagation speed, delay, attenuation, effective permittivity
- Differential and common-mode parameters
- Near- and far-end crosstalk coefficients
- Surface roughness modeling
- Creation of equivalent circuit models (SPICE sub-circuits/ladder-type lumped models)
- HSPICE®, PSPICE®, Spectre® and other Berkeley SPICE-compatible tools
- HSPICE W-element models (tabular frequency dependent) for transmission lines
- Cadence DML, Intel LCF and IBIS .pkg model
IBIS ICM model
- Simplorer® SML models
- Creation of frequency-domain S-parameters
- AC/DC R and L included in RL(f) model
- Distributed model
- Touchstone format supported
- Display of data/visualization of results
- Matrices of parasitics
- Current and voltage visualization for conductors
- Vector and magnitude field plots
- Model healing, resolution, and fault-tolerant meshing for CAD import
- GDSII import
- User-defined primitives (UDP) for customizable geometric elements/library of parts
- Integrated optimization/parametric solutions (cost option)
- Geometry and material parameterization
- Optimization, sensitivity, and statistical analysis
- Distributed Solve for parallel computing (option)
- Dynamic links to Ansoft Designer®, Nexxim® for EM-circuit co-simulation
- Coupled with Simplorer for power system modeling
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