Product Information • SIwave home • Product overview • Product features • Product datasheet (PDF) • Product options • What's your focus • Customer case studies • Supported operating systems Related News • Press releases • Related articles     Contact Sales   Technical Library Home > Products > SIwave > Signal- and Power-Integrity Analysis for High-Performance PCBs and IC Packages Featured Capabilities Full-wave analysis using 2D Finite Element Method (FEM) for layered structures Including loss and frequency dependence Fast convergence for interpolating sweeps Fast resonant mode analysis Fast and efficient DC solver (for IR drop verification) Accurately solve for S-, Y- and Z-parameters including DC Lumped RLC extraction from S-parameter data Near- and far-field radiation for EMI/EMC using the dynamic link with HFSS Impedance discontinuities in traces due to route layer and reference plane changes, and routing over split planes Analyze time-domain effects, such as: Propagation delay Rise and fall times Reflections and ringing Simultaneous switching noise (SSO/SSN) Noise coupling of traces and planes Power and ground bounce Simulate frequency-domain phenomena S-parameters Resonant modes/frequencies of complete power and ground planes Low-frequency inter-plane coupling Package and PCB co-simulation Merge single-instance IC package onto PCB for full-wave analysis Intuitive, easy-to-use layout editor Clip Design tool to quickly remove extraneous portions of complex designs Select geometry and circuit elements based on type View planes, traces, pads, circuit elements on per-layer basis Pin grouping capability, clusters pins into a single node Rapid port assignment between pin pairs or groups Rapid loading editor for large layouts Design validation check prior to solution Easily change pads into vias, allowing the emulation of solder-balls/bumps Analyze and visualize the effects of decoupling capacitor placement on planes Automatic adaptive mesh generation and refinement Component database, including Taiyo Yuden, Murata and TDK capacitor models Automated frequency spectrum transfer using dynamic link to Nexxim® v3.5 and DesignerSI™ v3.5 for non-steady-state time-domain simulation Frequency-dependent source implementation Linear interpolation to fit external source datasets External sources can have frequency-dependent impedance Frequency-dependent material model (Djordjevic-Sarkar) Causal trace and via models Visualization of near |E| and |H| fields Products | Support | Events/Training | Downloads | Corporate | University | Careers | Contact | Site Map Copyright 2008 Ansoft Corporation. All rights reserved. Privacy Statement