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Signal- and Power-Integrity Analysis for High-Performance PCBs and IC Packages
Featured Capabilities
- SYZ Network Analysis for Signal- and Power-Integrity PCB and Package Applications
- Trapezoidal and hexagonal trace cross-sections
- Frequency dependent dielectric loss
- Frequency dependent copper loss
- Surface roughness loss
- FEM via solutions for accuracy
- 2D MoM "real-time" trace characterization (Zo, Td, R, L, C, G,)
- TouchStone output (s-parameters)
- IBIS ICM output
- Lumped RLGC output
- Ansoft Full Wave Spice output
- DC I2R Solver for PCBs and Packages
- Adaptive mesh refinement
- DC Voltage drop, current density and power density analyses
- 3D solver for accurate via and wire bond analysis
- Loop resistance analysis
- Distributed resistive network outputs in SPICE format from the DC solver
- Linkage to ANSYS Icepak for thermal analysis
- Radiation Field Solvers PCBs and Packages
- Resonant cavity analysis
- Near-field analyses
- Far-field analyses
- Data dependent EMI/EMC simulations when combined with Ansoft Designer
- SIwave links to HFSS and acts as a radiation excitation source
- Layout and editing of PCBs and packages
- Clipping of designs from PCBs and packages
- Allows for re-use of older designs
- Removes extraneous portions of complex designs
- Merging of multiple packages onto a PCB
- Artwork creation
- Trace drawing utility
- Via padstack editor and designer
- Rectangular and polygon drawing utility
- Pin grouping capability, clusters pins into a single node
- Circuit element placement
- Ports, voltage sources, current sources
- Resistor, capacitor, and inductor elements
- Touchstone files
- Design validation checker with automatic correction
- Measuring utility
- Pads to vias for solder ball/bump emulation
- JEDEC standard wire bond creation utility
- Non-standard wire bond creation utility
- Solder bump/ball creation utility
- Library management
- Exporting/Importing of
- Stack up files
- Component mapping files
- SIwave templates
- Visual basic scripting
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Technical Library
