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Signal- and Power-Integrity Analysis for High-Performance PCBs and IC Packages
Featured Capabilities
- Full-wave analysis using 2D Finite Element Method (FEM) for layered structures
- Including loss and frequency dependence
- Fast convergence for interpolating sweeps
- Fast resonant mode analysis
- Fast and efficient DC solver (for IR drop verification)
- Accurately solve for S-, Y- and Z-parameters including DC
- Lumped RLC extraction from S-parameter data
- Near- and far-field radiation for EMI/EMC using the dynamic link with HFSS
- Impedance discontinuities in traces due to route layer and reference plane changes, and routing over split planes
- Analyze time-domain effects, such as:
- Propagation delay
- Rise and fall times
- Reflections and ringing
- Simultaneous switching noise (SSO/SSN)
- Noise coupling of traces and planes
- Power and ground bounce
- Simulate frequency-domain phenomena
- S-parameters
- Resonant modes/frequencies of complete power and ground planes
- Low-frequency inter-plane coupling
- Package and PCB co-simulation
- Merge single-instance IC package onto PCB for full-wave analysis
- Intuitive, easy-to-use layout editor
- Clip Design tool to quickly remove extraneous portions of complex designs
- Select geometry and circuit elements based on type
- View planes, traces, pads, circuit elements on per-layer basis
- Pin grouping capability, clusters pins into a single node
- Rapid port assignment between pin pairs or groups
- Rapid loading editor for large layouts
- Design validation check prior to solution
- Easily change pads into vias, allowing the emulation of solder-balls/bumps
- Analyze and visualize the effects of decoupling capacitor placement on planes
- Automatic adaptive mesh generation and refinement
- Component database, including Taiyo Yuden, Murata and TDK capacitor models
- Automated frequency spectrum transfer using dynamic link to Nexxim® v3.5 and DesignerSI™ v3.5 for non-steady-state time-domain simulation
- Frequency-dependent source implementation
- Linear interpolation to fit external source datasets
- External sources can have frequency-dependent impedance
- Frequency-dependent material model (Djordjevic-Sarkar)
- Causal trace and via models
- Visualization of near |E| and |H| fields
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