Featured Capabilities

• Provides seamless interoperability between Ansoft and the following third-party products and format.
  • Cadence®
    • Allegro® PCB, SiP Digital/RF, Allegro® APD, Virtuoso®
  • Mentor Graphics®
    • Board Station®, Expedition™, PADS Layout™
  • Zuken
    • CR-5000
  • Sigrity
    • UPD
  
• Generates ready-to-solve projects for HFSS™ , SIwave™, Q3D Extractor®, Ansoft Designer®, and TPA™
• Unites touching metal into single conductor (including traces on multiple layers)
• Generates 3D solid models of selected traces, supply planes and vias
• Edit stack-up properties, such as individual layer thickness, dielectric constant and conductivity
• Select nets for translation by net name(s), or point and click on specific traces or region of the board" Automatic de-featuring of selected nets to minimize model complexity and solution time

IC Layout Specific

• Exports specific "cells" (and their sub-cells)
• Merge via arrays into a single object to simplify the solid model and speed analysis

Packaging Layout Specific

• Generates 3D solid models for wire bonds, solder bumps, solder balls and irregularly shaped ground fill
• Automatically adds ports (HFSS) or sinks and sources (Q3D Extractor) to wire bonds and solder balls