Parics
Automated IC package geometry creation
Compatible with: HFSS, Q3D Extractor, Maxwell
Ansoft designed the ParICs Physical IC Modeler specifically to meet the needs of package engineering. With this automated modeling tool, engineers can generate models of leaded IC packages in minutes and use them for design, electrical characterization, and product documentation.
ParICs features:
- Spreadsheet-like prompts for JEDEC-like package parameters;
- Design Rule Checking for adherence to JEDEC-like and industry standards and manufacturability;
- Quick model generation for AutoCAD® and Ansoft 3D EM-based products
- Support on PCs and UNIX® workstations
